TBK 2208 Desktop BGA X-Ray Inspection Machine | Non-Destructive PCB & IC Fault Analysis

The TBK 2208 is a compact desktop X-ray inspection system engineered for the non-destructive testing (NDT) of electronic assemblies and components. Designed for mobile phone repair technicians and PCB quality control specialists, this unit provides high-resolution internal imaging to analyze BGA packages, IC chips, and multi-layer circuit boards. It enables the precise detection of manufacturing defects such as solder voids, bridging, and cold solder joints without requiring physical disassembly or damaging the component. Its desktop form factor offers a professional solution for failure analysis in limited workspace environments.

High-Density Lead Shielding: The chassis is constructed with an integrated, high-density heavy lead shielding chamber. This design effectively contains X-ray radiation, ensuring a safe operating environment for technicians in compliance with safety standards.

High-Resolution Imaging System: Equipped with a specialized X-ray sensor and a high-definition display screen, delivering clear visualization of internal component structures for the identification of microscopic defects.

Intelligent Operating Interface: Features a streamlined control system designed for operational efficiency. The software supports one-click sample capture, allowing users to acquire and analyze images rapidly.

Non-Destructive Testing (NDT): Performs contactless inspection, allowing for the comprehensive analysis of internal connections while ensuring the physical integrity of the motherboard or chip remains unaltered.

Defect Detection Capabilities: Specifically calibrated to identify common soldering issues in BGA and CSP packages, including voids (air bubbles), short circuits (bridging), and open connections.

• Brand: TBK
• Model: 2208
• Voltage: 110/220V
• Standby Power: 60W
• Exposure Power: 100W
• Pixel Diameter: 35μm
• Detector Area: 25*35*mm
• Resolution: 688*834px
• X-ray Tube Voltage: 60kV
• X-ray Tube Current: 0.8mA
• Product Dimensions: 240*240*415mm
• Net Weight: 12.5kg
• Packaging Dimensions: 350*350*560mm
• Packaging Weight: 23kg

Q1: What types of soldering defects can the TBK 2208 detect?
A1: The TBK 2208 is designed to detect internal soldering defects such as solder voids, bridging (shorts between balls), cold solder joints, and wire bond breaks within IC packages.

Q2: Is the TBK 2208 safe to use in a standard repair shop?
A2: Yes, the machine is built with an integrated high-density heavy lead shielding chamber to fully contain X-ray emissions, ensuring the safety of the operator and the surrounding environment.

Q3: Does the X-ray inspection damage the electronic components?
A3: No, the TBK 2208 utilizes non-destructive testing (NDT) technology. It uses X-rays to image the interior of the component without any physical contact or thermal damage to the device.

Q4: Why is X-ray inspection necessary for BGA repairs?
A4: Since BGA solder joints are located underneath the chip and cannot be seen with the naked eye or a standard microscope, X-ray inspection is the only way to verify that the soldering process was successful without removing the chip.

Q5: Is the software difficult for beginners to operate?
A5: The machine features an intelligent operating system designed for simplicity, including a one-click capture function that makes image acquisition straightforward for operators.